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| Wakefield Heat Sink and Extrusion Catalogs | |
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Please select a catalog version Catalog Request Form. Please provide the following information to recieve a copy of our catalog. (* Denotes a required field) |
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New!
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2007-2008 Thermal Management Standard Products
Wakefield's New
Standard Products Catalog is an easy reference guide
to our many standard profiles and thermal management applications and accessories |
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BGA Heat Sinks Wakefield’s BGA Heat Sink catalog includes a number of new products for BGAs, Super BGAs, PBGAs and FPBGAs. Applications include Network routers and switches, high resolution printers, digital cameras, video games, DVD and global positioning systems (GPS). |
| Stamped Heat Sinks for Low Power Devices Wakefield offers a wide range of board level power semiconductor heat sinks for surface mount and thru hole devices. This catalog contains a number of new devices. View catalog here |
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DC/DC Converter Heat Sinks Wakefield offers a comprehensive line of DC/DC Converter Heat Sinks for quarter, half and full brick sizes.These heat sinks are designed with anchoring slots to accommodate various mounting requirements and both natural and forced air convection installations. |
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| Bonded Fin Heat Sinks Wakefield has greatly expanded its line of high performance Bonded Fin Heat Sinks and now includes 20 available shapes for use with IGBTs, power modules, SCRs and other high power electronic components. Bonded fin products can be easily configured as maxiTHERM-HD3(TM) forced convection or natural convection assemblies. View catalog here |
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Standard Shapes |
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