Wakefield Thermal Solutions
 Intro to Thermal Management   RoHS Compliance   Check Inventory   Extrusion On-Line   Product Info   MSDS   Web Portal    Site Map  
Thermal Extrusion
Aerospace & Defense
Product Catalogs
Standard Products
· Extruded Heat Sinks
· High Density Extrusions
· Bonded Heat Sinks
· Stack Fin
· SwageFin
· Folded Fin Heat Sinks
· DC/DC Converter Heat Sinks
· Board Level Heat Sinks
· Microprocessor Heat Sinks
· Precision Clamp Systems
· Cold Plates
· Extruded Enclosures
· BGA/PGA Heat Sinks
· Accessories
· Heat Sink Catalogs
microprocessor heat sinks Microprocessor Heat Sinks

product Info
Wakefield Thermal Solutions, Inc. offers the new standard for excellence in microprocessor, ASICs, multichip modules, BGAs and integrated circuit heat dissipation: Penguin Coolers designed for superior thermal performance, reliability, and lowest-cost manufacturing, we have applied over 40 years of industry experience to develop a family of standard and custom heat sinks for application to IC packages of all types. Our standard designs provide off-the-shelf solutions at minimum cost for the OEM systems designer.