Wakefield Thermal Solutions
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Thermal Extrusion
Aerospace & Defense
Product Catalogs
Standard Products
· Extruded Heat Sinks
· High Density Extrusions
· Bonded Heat Sinks
· Stack Fin
· SwageFin
· Folded Fin Heat Sinks
· DC/DC Converter Heat Sinks
· Board Level Heat Sinks
· Microprocessor Heat Sinks
· Precision Clamp Systems
· Cold Plates
· Extruded Enclosures
· BGA/PGA Heat Sinks
· Accessories
· Heat Sink Catalogs
extruded enclosures Extruded Enclosures

product Info
Cost pressures, decreasing package sizes and increased thermal requirements has our engineering team looking beyond the conventional methods of cooling. Wakefield Thermal Solutions, Inc. has pioneered the use of extrusions to incorporate the heat sink surface area as an integral part of the overall assembly. Many features can be added to an enclosure during the extrusion process, eliminating or minimizing the need for secondary machining. A well designed extruded enclosure can provide a complete, cost effective solution.