Wakefield Thermal Solutions
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Thermal Extrusion
Aerospace & Defense
Product Catalogs
Standard Products
· Extruded Heat Sinks
· High Density Extrusions
· Bonded Heat Sinks
· Stack Fin
· SwageFin
· Folded Fin Heat Sinks
· DC/DC Converter Heat Sinks
· Board Level Heat Sinks
· Microprocessor Heat Sinks
· Precision Clamp Systems
· Cold Plates
· Extruded Enclosures
· BGA/PGA Heat Sinks
· Accessories
· Heat Sink Catalogs
bonded heat sinks Bonded Heat Sinks

product Info
Wakefield Thermal Solutions, Inc. offers a variety of natural and forced convection bonded fin heat sink assemblies. Configurable in a variety of ways, they are reliable, cost effective, and highly efficient thermal management solutions for high power and densely packaged applications, even in demanding shock and vibration environments. Bonded fin heat sinks are used when the required combination of large heat sink size, tall fins and high fin density make simple extrusions impractical.