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Wakefield Thermal Solutions, Inc. offers a wide range of board level power semiconductor heat sinks for surface mount and
thru hole devices, including JEDEC/EIA registered outlines TO-3, TO-218, TO-220, TO-247, and TO-263 (D2PAK). Also covered
are hex/stud mount diode outlines DO-4 to DO-11 as well as MULTIWATT® and axial lead devices. These products are available
in stamped and extruded aluminum, and selected stampings are manufactured out of copper.
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