Design

Wakefield Thermal Solutions provides thermal design services for the OEM designer who wishes to maximize system thermal performance. Wakefield draws from its extensive experience in design of standard thermal products, as well as innovative solutions to particular customer requests.

Few design elements today pose as destructive a threat to proper electronic system operation as elevated or runaway temperature, especially for high-speed microprocessors, ASIC's, and associated chip sets. Early consideration in system design for efficient heat dissipation for critical components can pay significant rewards throughout the OEM product cycle, reliable system operation over useful life, and for future system upgrades.

Call on our design engineering staff and CAD-based product design capabilities to provide versatile customized solutions for demanding design requirements. High-volume cell-based automated manufacturing equipment is in place in our multi-plant operations to support volume production requirements.

Analysis

Wakefield uses a number of analysis tools to ensure optimum thermal design. For basic heat sink analysis, Wakefield has developed its own tools to determine the effects of changing heat sink geometry on various thermal parameters. This is especially helpful for "on-line" customer support and where high-level design is not necessary.

For larger projects involving more complex systems, Wakefield employs Flotherm(TM) CFD software. This is commercially available, and allows graphical analysis of temperatures and flow conditions over a 3D space.

Testing

For cases where empirical results are desired, Wakefield has test facilities available. We can provide temperature data at multiple locations, as well as pressure drop data. Testing is possible for natural convection, and for forced convection up to 1000 CFM.