| Max SCR Diameter (mm) |
Wakefield Clamp Series |
Force Range (lbs)
|
Extrusion Profile |
| 101.6 |
ALL |
800-16,000 |
XX7151 |
| 84 |
ALL |
800-16,000 |
XX6351 |
| 63 |
ALL |
800-16,000 |
XX5735 |
| 63 |
144 |
800-6,000 |
XX5360 |
| 63 |
143 |
800-6,000 |
XX10239 |
| 63 |
144 |
800-6,000 |
016235 |
| 63 |
144 |
800-6,000 |
014442 |
| 63 |
143 |
800-6,000 |
XX3529 |
| 63 |
143 |
800-6,000 |
XX5730 |
| 63 |
143 |
800-6,000 |
014191 |
| 63 |
143 |
800-6,000 |
XX3849 |
| 50 |
143 |
800-6,000 |
XX5733 |
| 50 |
143 |
800-6,000 |
XX3559-2 |
| 50 |
143 |
800-6,000 |
XX5736 |
| 50 |
143 |
800-6,000 |
XX3561-2 |
| 50 |
143 |
800-6,000 |
XX5732 |
| 50 |
143 |
800-6,000 |
XX5731 |
| 50 |
143 |
800-6,000 |
XX3560-2 |
| 50 |
143 |
800-6,000 |
013450 |
| 50 |
143 |
800-6,000 |
XX4554 |
| 50 |
143 |
800-6,000 |
XX5311 |
| 50 |
143 |
800-6,000 |
003537 |
| 50 |
143 |
800-6,000 |
XX5306 |
| 50 |
143 |
800-6,000 |
132 Series |
| 50 |
143 |
800-6,000 |
133 Series |
| 40 |
143 |
800-6,000 |
014779 |
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SCR Heat Sink & Clamp Assemblies
Wakefield offers clamp compression system to align with its extensive thermal extrusion selection. This type of heat sink can be used mainly with high-power compression pack semiconductor devices (i.e. disc-packaged devices; also referred to as “hockey puck” semiconductor devices). These devices can include thyristors (SCRs) and rectifiers.
Wakefield precision clamp compression systems are available for mounting, compression, and clamping of high-power disc-packaged devices to 5.25 in. (133.4) diameters, and 16,000 lbs. (7257.5 kg) of clamping force. Aluminum heat sinks and extrusion profiles complement the clamp systems, providing total thermal management solutions for a broad range of electronic and electrical system applications.
Industries/ Applications for SCR Assemblies:
Transportation/ Locomotives
Power Distribution
Welding
Industrial Drives
UPS Power Supplies
Solar Energy/ Wind
Motor Controls
Useful Downloads: