Heat Sink Questionnaire

* = required

Name*

Company Name* Title

Address*

City* State* Zip* Country*

Phone* Email*

Product or project name

Please fill out as much as possible

Units: Inches or MM

1.

What type of electronic device will be cooled?

2.

How many of these devices will be cooled?

3.

How many watts of power must be dissipated from each device and in aggregate?

a.

Please specify - Each device: Total power:

b.

Is a drawing of the heat distribution of the base attached?

c. Is a drawing of the component attached?

4.

What is the maximum allowable junction temperature of this device?
NOTE: Check the manufacturer's data sheet.

a.

If no junction temperature has been specified, provide the maximum case temperature:

5.

What is the thermal resistance of the semiconductor from junction to case (Theta-jc)?
NOTE: Check the manufacturer's data sheet.

6.

Is electrical isolation required between the device case and the heat sink? a. At what voltage level?

7.

What finish is required on the heat sink (choose one) Anodize Paint Chromate

Hex-free conversion None Special: What color?

8.

What is the maximum ambient air temperature?

9.

What type of convection is required?

10.

If forced convection, have you chosen a fan?

Fan manufacturer/Part No. Fan size

Free flow (CFM) Static pressure (inches H20)

11.

Will you shroud the air flow (i.e., direct the air through the heat sink)?

If not, what is the cross-sectional size of the air space where the heat sink will be located?

X Width X Height

12.

How much space is available for the heat sink? Length X Width X Height Units

Samples needed by:

Prototype completion date:

Pre-production target date:

Production target date:

Range of usage:

Estimated annual usage (EAU):

Estimated program life expectancy:

Attachment 1:

Attachment 2:

Attachment 3:

Comments: