For maximum dissipation in air cooling versus the amount of occupied space, the concept of folded fin has no equal. Wakefield Solutions designs and manufactures folded fin heat sink assemblies for a variety of cooling applications, ranging from small microprocessors to large industrial power supplies. The assemblies consist of a flexible foil or sheet made of aluminum or copper, folded into a square wave or similar pattern, and attached to a conductive base plate. Attachment method can be conductive epoxy, soldering, or brazing, depending on cost and performance needs. Wakefield can also manufacture multilayer folded fin assemblies to further enhance thermal performance.