Wakefield Solutions, Inc. provides a broad line of extruded heat sinks and associated products, as well as technical services designed to provide complete thermal management solutions serving the commercial, industrial, military, and medical industries. Typical applications include semiconductors packaged in industry standard case styles, stud-mount, compression devices, power modules, SCR's, IGBT's, SSR's and isolated flat base devices. For high-performance applications, the heat sink design may require high fin densities; Wakefield Solutions, Inc. can in many instances push extrusions with aspect ratios to 14:1. If the application requires a large heat sink, Wakefield Solutions, Inc. can extrude many shapes beyond 10" diagonals.